1206 Electronic Components Miniature Chipe Type Slow Blow Time-lag Time-Lag SMD Surface Mount Fuses
Electrical Characteristcs
| Rated Current | % of AmpRating | Opening Time |
| 250mA~10A | 100% | 4hours, min |
| 1A~3A | 200% | 1.0s - 60 s |
| 1A~5A | 250% | 5.0s max |
| 1A~5A | 300% | 0.1s - 3.0 s |
| 250mA~750mA | 350% | 5.0s max |
| 6A~10A | 350% | 5.0s max |
| 250mA~10A | 1000% | 0.2ms - 20.0 ms |
Specification
| Part No. | Rated Voltage | Rated Current | Breaking Capacity | Typical Cold Resistance (mOhms)² | Typical Voltage Drop (mV) | Typical Pre-Arcing I²t
(A²Sec)³ | Marking |
| 12.100.0.25 | 72Vdc 125Vdc | 63Vdc | 32Vdc 24Vdc | 250mA | 100A@ 72Vdc 125 Vdc | 100A@ 63Vdc | 100A@ 32Vdc 300A@ 24Vdc | 3700 | 1350 | 0.00038 | I |
| 12.100.0.375 | 375mA | 1850 | 720 | 0.00077 | E |
| 12.100.0.5 | 500mA | 1050 | 690 | 0.0019 | B |
| 12.100.0.75 | 750mA | 775 | 680 | 0.15 | C |
| 12.100.1 | 1A | 485 | 550 | 0.18 | H |
| 12.100.1.5 | 1.5A | 218 | 355 | 0.4 | K |
| 12.100.2 | 2A | 133 | 310 | 1.1 | N |
| 12.100.2.5 | 2.5A | 79 | 230 | 1.7 | O |
| 12.100.3 | 3A | 49 | 185 | 2.2 | P |
| 12.100.3.5 | 3.5A | - | 37 | 175 | 2.7 | R |
| 12.100.4 | 4A | 33 | 160 | 3.2 | S |
| 12.100.4.5 | 4.5A | 28 | 150 | 4.2 | X |
| 12.100.5 | 5A | 22 | 135 | 6 | T |
| 12.100.6 | | - | 6A | - | 15.5 | 140 | 12 | F |
| 12.100.7 | 7A | 11.5 | 120 | 18 | J |
| 12.100.8 | 8A | 8.0 | 100 | 18 | V |
| 12.100.10 | 10A | 7.0 | 90 | 30 | U |
Description
1206 SLOW BLOW SMD FUSE
12.100 Series are the fuses set the industry standard for performance, reliability
and quality. The solder-free design provides excellent on-off and temperature
cycling characteristics during use and also makes our SMD fuses more heat and
shock tolerant than typical subminiature fuses.
Features
Rapid interruption of excessive current
Compatible with reflow and wave solder
Ceramic and glass construction
One time positive disconnect
Lead free and Halogen free material
Applicatons
Secondary circuit protection
Laptop, notebook, netbook
Flat panel displays
High definition television(HDTV)
LCD/LED backlighting Computers and peripherals
Gaming console systems
Handheld/portable equipment
Mobile device charges
Automotive
Central body control module
Heating ventilation and air conditioning
Doors,window lift and seat control
Digital instrument cluster
In-vehicle infotainment and navigation
Electric pumps,motor control
Powertrain control module(PCU)/Engine
Transimission Control Unit(TCU)
Installation Recommendations
| Reflow Conditon | Pb-free assembly |
| Pre Heat | - Temperature Min (Ts(min)) | 150℃ |
| - Temperature Max (Ts(max)) | 200℃ |
| - Time (Min to Max) (ts) | 60 – 120 seconds |
Average Ramp-up Rate (Liquidus Temp
(TL) to peak) | 3℃/second max. |
| TS(max) to TL - Ramp-up Rate | 5℃/second max. |
| Reflow | - Temperature (TL) (Liquidus)
- Temperature (tL) | 217℃
60 – 150 seconds |
| Peak Temperature (TP) | 260+0/-5℃ |
| Time within 5°C of actual peak Temperature (tp) | 30 seconds |
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed | 6°C/second max
8 minutes max. 260°C |
Product Characteristics
| Materials | Body: Ceramic
Terminatons: Silver over-plated with tin
Element: Alloy(Ag,Cu,Zn)
Cover Coat:Glass |
| Operatng Temperature | -55°C to 125°C
Consult temperature rerating curve chart. |
| Thermal Shock | 300 cycles -55°C to 125°C |
| Humidity | MIL-STD-202F, Method 103B,Condition D |
| Vibraton | Per MIL-STD-202F, Method 201A |
| Insulaton Resistance (Afer Opening) | Greater than 10,000 ohms |
| Resistance to Soldering Heat | MIL-STD-202G,Method 210F, Condition D |
Packaging
3,000 pieces of fuses in plastic or paper taper
| Symbol | Ao | Bo | Ko | Po | P1 | P2 |
| Spec | 1.80±0.10 | 3.50±0.10 | 1.27±0.10 | 4.00±0.10 | 4.00±0.10 | 2.00±0.10 |
| Symbol | E | F | Do | D1 | W | T |
| Spec | 1.75±0.10 | 3.50±0.10 | 1.50±0.10 | 1.00(Max) | 8.00±0.10 | 0.23±0.02 |
Contact Details:
Andy Wu
Email: andy@tianrui-fuse.com.cn
MP/Whatsapp: +86 13532772961
Wechat: HFeng0805
Skype: andywutechrich
QQ: 969828363
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Electronic Components 1206 Surface Mount Fuses Miniature Chipe Type Images
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